DocumentCode
3361945
Title
Role of Test in Yield Learning for 65nm and Beyond
Author
Segers, R.
Author_Institution
Philips Semicond., Nijmegen
fYear
2006
fDate
22-27 Oct. 2006
Firstpage
1
Lastpage
1
Abstract
Only recently it has become pretty clear that back-end technologies can no longer be seen as an independent operation or as an after-thought. Specifically the "test" arena is changing dramatically from a pure good/bad decision maker towards a key information provider on the product e.g. on the manufacturing process. This enhanced test data contributes, or even drives, following yield and quality improvement actions. To be able to do so the test data is next linked with internal wafer fab (in-line) data, as well as with specific design information like layout structures. From the resulting defect pareto it can be decided to either take action on the (manufacturing) process (in the wafer fab), or towards the design area. The latter may then lead to enhanced design for manufacturing rules or in changing parameters like timing or power margins. This then, ideally, closes the loop between manufacturing and design
Keywords
design for manufacture; integrated circuit yield; 65 nm; design for manufacture; design information; layout structures; manufacturing process; power margins; quality improvement; timing margins; yield improvement; yield learning; Contacts; Electric variables; Electronics industry; Etching; Foundries; Lithography; Production; Semiconductor device manufacture; Semiconductor device testing; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 2006. ITC '06. IEEE International
Conference_Location
Santa Clara, CA
ISSN
1089-3539
Print_ISBN
1-4244-0292-1
Electronic_ISBN
1089-3539
Type
conf
DOI
10.1109/TEST.2006.297768
Filename
4079446
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