Title :
Experiments and Numerical Simulations on Local Degradation Characteristics of Coated Conductor Due to Overcurrent
Author :
Xudong Wang ; Tao Wang ; Ishiyama, Atsushi ; Yagi, Masashi ; Maruyama, Osamu ; Ohkuma, Takeshi
Author_Institution :
Dept. of Electr. Eng. & Biosci., Waseda Univ., Tokyo, Japan
Abstract :
Coated conductors are subjected to short-circuit currents 10 to 30 times greater than the operating current in the use of superconducting power cables. The Ic and thickness of the stabilizer are considered to be nonuniformly distributed in the real manufacturing process. Thus, the coated conductor may be damaged locally by the hot spot due to the overcurrent. Therefore, it is important to clarify the local degradation characteristics of the coated conductor and determine its tolerance against the fault current in the actual operation. In a previous study, overcurrent experiments and numerical simulations on thermal stress-strain were carried out on a coated conductor with a nonuniformly distributed Ic. In this study, two samples with nonuniformly distributed copper plating thickness were tested. Numerical simulations based on the finite element method were performed to simulate the temperature and thermal stress-strain distribution caused by the overcurrent. The nonuniform thickness of the copper plating and the longitudinal length of the nonuniform area were considered as the simulation parameters.
Keywords :
copper; finite element analysis; high-temperature superconductors; short-circuit currents; stress-strain relations; superconducting cables; Cu; coated conductor; fault current; finite element method; hot spot; local degradation characteristics; overcurrent; short circuit current; stabilizer; superconducting power cables; thermal stress-strain distribution; tolerance; Conductors; Copper; Degradation; Integrated circuits; Temperature measurement; Thermal stresses; Yttrium barium copper oxide; Degradation; finite element method; short circuit current; thermal stress;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2013.2238592