• DocumentCode
    3362014
  • Title

    Effect of content on dielectric performance of polyimide / TiO2 hybrid films

  • Author

    Xiaoxu Liu ; Jinghua Yin ; Minghua Chen ; Yu Feng ; Guang Li

  • Author_Institution
    Center for Eng. Training & Basic Experimentation, Heilongjiang Inst. of Sci. & Technol., Harbin, China
  • Volume
    4
  • fYear
    2011
  • fDate
    12-14 Aug. 2011
  • Firstpage
    2037
  • Lastpage
    2039
  • Abstract
    In situ polymerized polyimide/TiO2 composite films with good electrical performance are studied. These nanocomposite films are also characterized by scanning electron microscopy (SEM). SEM analyses show that the spherical shaped titania particles and the ceramic particles distribute uniformly in the matrix of hybrid film. Dielectric properties of the films are measured in the frequency range of 102Hz-105 Hz by an impedance analyzer at room temperature. The dielectric constant varies with the sweeping frequency and filler content and it decreases with sweeping frequency. It is demonstrated that the breakdown strength reaches its maximum value when the content of filled TiO2 is 0.5 wt.%, and then decreases with the increase of the concentration of the filler.
  • Keywords
    ceramics; electric breakdown; electrochemical impedance spectroscopy; filled polymers; nanocomposites; nanofabrication; organic-inorganic hybrid materials; permittivity; polymerisation; scanning electron microscopy; semiconductor thin films; titanium compounds; SEM; TiO2; breakdown strength; ceramic particles; dielectric constant; dielectric property; electrical property; frequency 102 Hz to 105 Hz; impedance analyzer; nanocomposite films; polyimide hybrid films; polymerization; scanning electron microscopy; spherical shaped titania particles; sweeping frequency; temperature 293 K to 298 K; Dielectric constant; Electric breakdown; Films; Polyimides; Polyimide/TiO2; content; dielectric performance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic and Mechanical Engineering and Information Technology (EMEIT), 2011 International Conference on
  • Conference_Location
    Harbin, Heilongjiang, China
  • Print_ISBN
    978-1-61284-087-1
  • Type

    conf

  • DOI
    10.1109/EMEIT.2011.6023501
  • Filename
    6023501