Development of low-temperature drop shock resistant solder alloys for handheld devices

As handheld devices become increasingly smaller and complex, there is a shift in reliability requirements of solder pastes. Considering that thermal management and drop resistance of such devices become more challenging, improved thermal fatigue and mechanical shock properties grow into must have requirements. Additionally, multi-step assembly process and a surge in use of temperature sensitive components bring additional challenges that necessitate the use of low temperature alloys. Here we present the findings of our Alloy Development Program on the next generation of low temperature alloys that can be used in reflow soldering temperatures from 170 to 200°C. By using micro-additives we have created low temperature alloys with superior mechanical properties, higher drop shock resistance and improved fatigue life.