• DocumentCode
    3362104
  • Title

    Deep submicron effects on data converter building blocks

  • Author

    Evans, W.P. ; Burnell, D.

  • Author_Institution
    Cadence Design Syst., Columbia, MD
  • fYear
    2008
  • fDate
    21-24 Sept. 2008
  • Firstpage
    725
  • Lastpage
    728
  • Abstract
    Physical effects in deep submicron processes can affect reliability, performance, and even functionality in common circuit building blocks used in data converters. NBTI (Negative Bias Temperature Instability), STI (Shallow Trench Isolation) stress, and NWELL proximity effects will be reviewed and examples are given of circuit topologies and layout practices which can minimize the detrimental aspects these effects on commonly used blocks such as comparators, op-amps, and high speed flip-flops.
  • Keywords
    comparators (circuits); convertors; flip-flops; integrated circuit design; integrated circuit reliability; network topology; operational amplifiers; circuit layout practices; circuit topologies; comparators; data converter building blocks; deep submicron processes; high speed flip-flops; negative bias temperature instability; op-amps; shallow trench isolation; Circuits; Latches; MOS devices; MOSFETs; Negative bias temperature instability; Niobium compounds; Pipelines; SPICE; Stress; Titanium compounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference, 2008. CICC 2008. IEEE
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4244-2018-6
  • Electronic_ISBN
    978-1-4244-2019-3
  • Type

    conf

  • DOI
    10.1109/CICC.2008.4672189
  • Filename
    4672189