DocumentCode
3362104
Title
Deep submicron effects on data converter building blocks
Author
Evans, W.P. ; Burnell, D.
Author_Institution
Cadence Design Syst., Columbia, MD
fYear
2008
fDate
21-24 Sept. 2008
Firstpage
725
Lastpage
728
Abstract
Physical effects in deep submicron processes can affect reliability, performance, and even functionality in common circuit building blocks used in data converters. NBTI (Negative Bias Temperature Instability), STI (Shallow Trench Isolation) stress, and NWELL proximity effects will be reviewed and examples are given of circuit topologies and layout practices which can minimize the detrimental aspects these effects on commonly used blocks such as comparators, op-amps, and high speed flip-flops.
Keywords
comparators (circuits); convertors; flip-flops; integrated circuit design; integrated circuit reliability; network topology; operational amplifiers; circuit layout practices; circuit topologies; comparators; data converter building blocks; deep submicron processes; high speed flip-flops; negative bias temperature instability; op-amps; shallow trench isolation; Circuits; Latches; MOS devices; MOSFETs; Negative bias temperature instability; Niobium compounds; Pipelines; SPICE; Stress; Titanium compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Custom Integrated Circuits Conference, 2008. CICC 2008. IEEE
Conference_Location
San Jose, CA
Print_ISBN
978-1-4244-2018-6
Electronic_ISBN
978-1-4244-2019-3
Type
conf
DOI
10.1109/CICC.2008.4672189
Filename
4672189
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