Title :
Regression model of oxidation behavior of 6061 Al/SiC composite with and without protective coatings
Author :
Priyamvada, B. ; Rajasekaran, Sanguthevar ; Udayashankar, N.K. ; Nayak, Jagannath
Author_Institution :
Dept. of Metall. & Mater. Eng., Nat. Inst. of Technol. Karnataka, Mangalore, India
Abstract :
This paper analyses the variation of weight gain, Δm, of 6061 Al/SiC composite due to oxidation with time, t, using regression model. Using curve fitting technique, the mathematical equations for the oxidation behavior of the composite are formulated. The generated data according to the mathematical equations are analyzed and compared with the experimental data. More specifically, regression analysis helps in understanding how the typical value of the mass gain (dependent variable) changes when the time of oxidation (independent variable) is varied, while the other independent variable (Temperature) held fixed. Since the oxidation resistance of the 6061Al/SiC composite decreases due to the presence of alloying elements precipitates in the matrix, the effect of aging treatment and protective coatings like Aluminium and AlCrN on the oxidation behavior of the composite is studied. It is observed that the coatings increase the oxidation resistance of the composite. The regression analysis carried out shows a threefold linear variation of weight gain (Dependent variable) with respect to time and temperature of oxidation (Independent variables).
Keywords :
ageing; alloying; aluminium; aluminium compounds; chromium compounds; composite materials; curve fitting; oxidation; precipitation; protective coatings; regression analysis; silicon compounds; wide band gap semiconductors; 6061 aluminum-silicon carbide composites; Al-SiC-AlCrN; aging; alloying elements; curve fitting; mass gain; mathematical equations; oxidation resistance; precipitation; protective coatings; regression analysis; threefold linear variation; weight gain; Aluminum; Oxidation; 6061Al/SiC Composite; AlCrN and Oxidation behavior; Regression model;
Conference_Titel :
Nanotechnology Materials and Devices Conference (NMDC), 2011 IEEE
Conference_Location :
Jeju
Print_ISBN :
978-1-4577-2139-7
DOI :
10.1109/NMDC.2011.6155279