Fabrication of copper nanoparticles in 6FDA-ODA polyimide film

We investigate the formation of Cu nanoparticles in a polyimide (PI) film. The Cu nanoparticles were uniformly dispersed in the PI film by curing a precursor of PI, polyamic acid (PAA) containing Cu ions. The PAA was imidized to PI at 350°C for 2 hours in forming gas (5% H2+95% N2), accompanying the nanoparticle precipitation. X-ray diffracton patterns revealed that Cu nanoparticles formed by curing in a reducing atmosphere, and transmission electron microscopy showed that about 5 nm sized Cu nanoparticles were dispersed in the PI film.