DocumentCode :
3362849
Title :
SSOI technology for integrated Schottky barrier diode
Author :
Gamble, H.S. ; Baine, P. ; Bain, M. ; Armstrong, B.M. ; Mitchell, S.J.N. ; Fusco, V.F. ; Stewart, J.A.C.
Author_Institution :
Sch. of Electr. & Electron. Eng., Queen´s Univ., Belfast, UK
fYear :
2001
fDate :
14-14 Sept. 2001
Firstpage :
88
Lastpage :
91
Abstract :
In fabricating MMICs on silicon, a conflict arises between the requirement of low resistivity silicon (LRS) for active device fabrication, and very high resistivity silicon (VHRS) for low interconnect loss. Two differing solutions are presented here. Low loss CPW lines have been fabricated on oxidised porous silicon (OPS) formed on 1-3 /spl Omega/cm silicon wafers, yielding typical losses of 8.5 dB/cm at 30 GHz. Alternatively, silicon on insulator (SOI) substrates, produced by bonding 1-3 /spl Omega/cm silicon wafers to 2-4 k/spl Omega/ "handle" wafers, give CPW line losses of 2.2 dB/cm at 30 GHz. In addition, by incorporating a buried tungsten layer to form a silicon-on-silicide-on-insulator (SSOI) structure, integrated Schottky barrier diodes, with low and controllable C/sub j/ and R/sub s/, can be produced.
Keywords :
MMIC; Schottky diodes; buried layers; coplanar waveguides; electrical resistivity; losses; microwave diodes; semiconductor device metallisation; silicon-on-insulator; wafer bonding; 1 to 3 ohmcm; 2 to 4 kohm; 30 GHz; CPW line losses; MMIC fabrication; SOI substrates; SSOI structure; SSOI technology; Si-WSi/sub 2/-SiO/sub 2/; VHRS; active device fabrication; buried tungsten layer; handle wafers; integrated Schottky barrier diode; integrated Schottky barrier diodes; interconnect loss; junction capacitance; losses; low loss CPW lines; low resistivity silicon; oxidised porous silicon; series resistance; silicon; silicon on insulator substrates; silicon wafer bonding; silicon wafers; silicon-on-silicide-on-insulator structure; very high resistivity silicon; Conductivity; Conductors; Coplanar waveguides; Fabrication; Schottky barriers; Schottky diodes; Silicon compounds; Silicon on insulator technology; Tungsten; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Silicon Monolithic Integrated Circuits in RF Systems, 2001. Digest of Papers. 2001 Topical Meeting on
Conference_Location :
Ann Arbor, MI, USA
Print_ISBN :
0-7803-7129-1
Type :
conf
DOI :
10.1109/SMIC.2001.942346
Filename :
942346
Link To Document :
بازگشت