Title :
Switching behaviour of fast high voltage SiC pn-diodes
Author :
Mitlehner, Heinz ; Friedrichs, Peter ; Peters, Dethard ; Schorner, Reinhold ; Weinert, Ulrich ; Weis, Benno ; Stephani, Dietrich
Author_Institution :
Corp. Res. & Dev., Siemens AG, Erlangen, Germany
Abstract :
4H-SiC p-n diodes with an active area of 1 mm2 and up to 3 kV blocking voltage have been fabricated, characterized and compared to simulations. The static forward characteristics demonstrate the expected forward power loss with a negative temperature coefficient. The diodes exhibit a stable avalanche breakdown, showing a small positive temperature coefficient (0.3 V/K). The turn-on switching behaviour shows a relatively small voltage overshoot as compared to silicon diodes. The turn-off resembles that of a Schottky diode. In both cases, the dynamics can be attributed to a rapid recombination of the storage charge, even under high forward injection conditions. Numerical simulations may point to a local lifetime reduction at the p-n junction
Keywords :
avalanche breakdown; carrier lifetime; electron-hole recombination; losses; numerical analysis; p-n junctions; power semiconductor diodes; power semiconductor switches; semiconductor device models; semiconductor device testing; semiconductor materials; silicon compounds; 1 mm; 3 kV; 4H-SiC p-n diodes; Schottky diode-type turn-off; SiC; active area; blocking voltage; forward injection conditions; forward power loss; high voltage SiC pn-diodes; local lifetime reduction; negative temperature coefficient; numerical simulations; p-n junction; positive temperature coefficient; rapid storage charge recombination; simulation; stable avalanche breakdown; static forward characteristics; switching behaviour; turn-on switching behaviour; voltage overshoot; Annealing; Avalanche breakdown; Breakdown voltage; Chemical vapor deposition; Doping; Leakage current; Research and development; Schottky diodes; Silicon carbide; Temperature;
Conference_Titel :
Power Semiconductor Devices and ICs, 1998. ISPSD 98. Proceedings of the 10th International Symposium on
Conference_Location :
Kyoto
Print_ISBN :
0-7803-4752-8
DOI :
10.1109/ISPSD.1998.702652