DocumentCode :
3363611
Title :
Nano cobalt coating corrosion behavior obtained by DC and PC electrodeposition process
Author :
Cheraghi, M. Siadat ; Allahkaram, S.R. ; Towhidi, N. ; Khonsari, S.K. ; Rabizadeh, T.
Author_Institution :
Sch. of Metall. & Mater. Eng., Univ. of Tehran, Tehran, Iran
fYear :
2011
fDate :
18-21 Oct. 2011
Firstpage :
228
Lastpage :
231
Abstract :
In this study direct (DC) and Pulse (PC) current electroplating technique was used for coating of nano Co onto copper. The coating applied by cathodic pulse electrodeposition and the variation of electrochemical parameters such as current density and pulse conditions caused a marked change in the microstructure of the deposit. Characterization of coated was investigated by XRD, and SEM techniques. The deposited nanocrystalline Co on the Cu substrate in the experimental conditions achieved ultra fine crystalline structure is about 65nm. The corrosion behavior of coarse grain (CG) and nanocrystalline Co was studied by using potentiodynamic polarization test and electrochemical impedance spectroscopy (EIS) in 3.5%wt sodium Chloride (NaCl) solution. Results showed that in the NaCl solution, the Nanocrystalline Co exhibited improved corrosion resistance when compared with coarse grained Co coatings, which is due to the higher grain boundary density in nanocrystalline materials to quickly form a stable and protective passive film.
Keywords :
X-ray diffraction; cobalt; corrosion protective coatings; corrosion resistance; electrochemical impedance spectroscopy; electroplating; grain boundaries; metallic thin films; nanofabrication; nanostructured materials; scanning electron microscopy; Co; Cu; SEM; XRD; cathodic pulse electrodeposition; coarse grained coatings; corrosion resistance; current density; direct current electroplating technique; electrochemical impedance spectroscopy; electrochemical parameters; higher grain boundary density; nanocobalt coating corrosion behavior; nanocrystalline deposition; nanocrystalline materials; potentiodynamic polarization testing; protective passive film; pulse current electroplating technique; sodium chloride solution; stable passive film; ultrafine crystalline structure; Coatings; Copper; Magnetic films; Microstructure; Out of order; Resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nanotechnology Materials and Devices Conference (NMDC), 2011 IEEE
Conference_Location :
Jeju
Print_ISBN :
978-1-4577-2139-7
Type :
conf
DOI :
10.1109/NMDC.2011.6155348
Filename :
6155348
Link To Document :
بازگشت