Characterization test plan for a PCB to DIE transition in a fcCBGA application

Author

Cubillo, J.R. ; Gaubert, J. ; Bourdel, S. ; Barthélémy, H.

Author_Institution

L2MP Dpt Microelectronique et Telecommun. Marseille, Marseille

fYear

2007

fDate

11-14 Dec. 2007

Firstpage

609

Lastpage

612

Abstract

In this paper we analyze a characterization test plan of a printed circuit board (PCB) to a flip chip DIE transition trough a Ceramic Ball Grid Array (CBGA) package. From Finite Element Method (FEM) simulation results, we propose a testing methodology to extract the wide band RF scattering S parameters of the PCB to the DIE transition. The test plan includes a deembedding Short Open Line (SOL) technique, and a Trough Reflect Line (TRL) calibration on PCB.

Keywords

ball grid arrays; ceramic packaging; electromagnetic wave scattering; finite element analysis; flip-chip devices; printed circuit design; printed circuit testing; ceramic ball grid array; characterization test plan; finite element method simulation; flip chip DIE transition; printed circuit board; short open line; trough reflect line; wide band RF scattering; Ceramics; Circuit simulation; Circuit testing; Electronics packaging; Finite element methods; Flip chip; Printed circuits; Radio frequency; Scattering parameters; Wideband;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics, Circuits and Systems, 2007. ICECS 2007. 14th IEEE International Conference on

Conference_Location

Marrakech

Print_ISBN

978-1-4244-1377-5

Electronic_ISBN

978-1-4244-1378-2

Type

conf

DOI

10.1109/ICECS.2007.4511065

Filename

4511065