Title :
Characterization test plan for a PCB to DIE transition in a fcCBGA application
Author :
Cubillo, J.R. ; Gaubert, J. ; Bourdel, S. ; Barthélémy, H.
Author_Institution :
L2MP Dpt Microelectronique et Telecommun. Marseille, Marseille
Abstract :
In this paper we analyze a characterization test plan of a printed circuit board (PCB) to a flip chip DIE transition trough a Ceramic Ball Grid Array (CBGA) package. From Finite Element Method (FEM) simulation results, we propose a testing methodology to extract the wide band RF scattering S parameters of the PCB to the DIE transition. The test plan includes a deembedding Short Open Line (SOL) technique, and a Trough Reflect Line (TRL) calibration on PCB.
Keywords :
ball grid arrays; ceramic packaging; electromagnetic wave scattering; finite element analysis; flip-chip devices; printed circuit design; printed circuit testing; ceramic ball grid array; characterization test plan; finite element method simulation; flip chip DIE transition; printed circuit board; short open line; trough reflect line; wide band RF scattering; Ceramics; Circuit simulation; Circuit testing; Electronics packaging; Finite element methods; Flip chip; Printed circuits; Radio frequency; Scattering parameters; Wideband;
Conference_Titel :
Electronics, Circuits and Systems, 2007. ICECS 2007. 14th IEEE International Conference on
Conference_Location :
Marrakech
Print_ISBN :
978-1-4244-1377-5
Electronic_ISBN :
978-1-4244-1378-2
DOI :
10.1109/ICECS.2007.4511065
