• DocumentCode
    3363773
  • Title

    Development of a MEMS test platform for investigating the use of multi-walled CNT composites electric contacts

  • Author

    Lewis, A.P. ; Chianrabutra, C. ; Liudi Jiang ; Suan Hui Pu ; McBride, J.W.

  • Author_Institution
    Fac. of Eng. & the Environ., Univ. of Southampton, Southampton, UK
  • fYear
    2013
  • fDate
    11-13 Dec. 2013
  • Firstpage
    472
  • Lastpage
    478
  • Abstract
    The use of gold-coated multi-walled carbon nanotube (Au/MWCNT) composites have been shown to extend the life of electrical contacts, in previous work. Due to the long lifetimes (which are of the order of 106 up to 108 cycles) the lifetime testing tends to be highly time consuming. In this work we discuss the design and development of an electrostatically actuated MEMS cantilever beam which enables testing at higher frequencies than our previous experimental rig. Following calculations using fundamental cantilever beam equations, a computational model of the designed beam was developed to accurately predict the characteristics of the beam, including the resonant frequency, pull-in voltage and contact force. Where possible the values from the model have been compared with the fabricated MEMS cantilever beam. A MEMS-based electrostatically actuated cantilever beam has been fabricated and incorporated with Au/MWCNT composite surfaces to form a MEMS switch test platform. Initial results show the improved performance over a PZT based test platform.
  • Keywords
    cantilevers; carbon nanotubes; composite materials; electrical contacts; gold; life testing; microswitches; Au; MEMS cantilever beam; MEMS switch test platform; PZT; cantilever beam equations; carbon nanotubes; computational model; contact force; electric contacts; electrical contacts; lifetime testing; multi-walled CNT composites; pull-in voltage; resonant frequency; Contacts; Gold; Micromechanical devices; Resonant frequency; Silicon; Structural beams; Switches;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4799-2832-3
  • Type

    conf

  • DOI
    10.1109/EPTC.2013.6745765
  • Filename
    6745765