Title :
Integrated passive filters based on silicon substrate for SiP application
Author :
Tongyu Zhao ; Jian Cai ; Yinan Li ; Qian Wang ; Dejun Wang
Author_Institution :
Inst. of Microelectron., Tsinghua Univ., Beijing, China
Abstract :
This paper presents a system in package (SiP) application of integrated passive device (IPD) filters based on silicon substrate. Four kinds of IPD filters, mainly constructed with planar spiral inductors and metal-insulator-metal (MIM) capacitors, were designed and integrated. Moreover, the process flow is detailed described. Through comparison between simulation results and experiment results, thick Cu metal layer together with BCB dielectric material is proved to be a proper approach to modify filter´s Q factor.
Keywords :
MIM devices; Q-factor; passive filters; system-in-package; thin film capacitors; thin film inductors; BCB dielectric material; Cu; Si; filter Q factor; integrated passive device filter; integrated passive filter; metal-insulator-metal capacitor; planar spiral inductor; system in package application;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th
Conference_Location :
Singapore
Print_ISBN :
978-1-4799-2832-3
DOI :
10.1109/EPTC.2013.6745772
