DocumentCode
3363897
Title
Integrated passive filters based on silicon substrate for SiP application
Author
Tongyu Zhao ; Jian Cai ; Yinan Li ; Qian Wang ; Dejun Wang
Author_Institution
Inst. of Microelectron., Tsinghua Univ., Beijing, China
fYear
2013
fDate
11-13 Dec. 2013
Firstpage
510
Lastpage
515
Abstract
This paper presents a system in package (SiP) application of integrated passive device (IPD) filters based on silicon substrate. Four kinds of IPD filters, mainly constructed with planar spiral inductors and metal-insulator-metal (MIM) capacitors, were designed and integrated. Moreover, the process flow is detailed described. Through comparison between simulation results and experiment results, thick Cu metal layer together with BCB dielectric material is proved to be a proper approach to modify filter´s Q factor.
Keywords
MIM devices; Q-factor; passive filters; system-in-package; thin film capacitors; thin film inductors; BCB dielectric material; Cu; Si; filter Q factor; integrated passive device filter; integrated passive filter; metal-insulator-metal capacitor; planar spiral inductor; system in package application;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th
Conference_Location
Singapore
Print_ISBN
978-1-4799-2832-3
Type
conf
DOI
10.1109/EPTC.2013.6745772
Filename
6745772
Link To Document