Effect of processing on the microstructure and fracture of solder microbumps in 3D packages

Author

Chen, Zhe ; Talebanpour, B. ; Huang, Z. ; Kumar, Pranaw ; Dutta, I.

Author_Institution

Sch. of Mech. & Mater. Eng., Washington State Univ., Pullman, WA, USA

fYear

2013

fDate

11-13 Dec. 2013

Firstpage

534

Lastpage

537

Abstract

Solder microbumps are receiving increasing interest due to their application in 3D-packages which facilitate the miniaturization of electronic devices. The reliability of microbumps during a drop event is of great concern because of their large proportion of intermetallic compounds (IMCs) which are of brittle nature. In this paper, the growth kinetics of IMCs in solder joints were analyzed. Compact mixed mode (CMM) samples with an adhesive solder joint between Cu substrates were used to simulate microbumps for evaluation of the fracture properties. The effect of IMC proportion, strain rate, and mode mixity on fracture toughness were investigated. It was found that with increasing aging, the IMC proportion increased, leading to lower fracture toughness and more brittle fracture. In addition, the fracture toughness decreased with increasing strain rate and mode mixity.

Keywords

adhesives; ageing; brittle fracture; crystal microstructure; electronics packaging; fracture toughness; reliability; solders; 3D packages; CMM samples; Cu; Cu substrates; adhesive solder joint; aging; brittle fracture; brittle nature; compact mixed mode samples; drop event; electronic devices; fracture toughness; growth kinetics; intermetallic compounds; joints were; microstructure; mode mixity; reliability; solder microbumps; strain rate; Conferences; Decision support systems; Electronics packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th

Conference_Location

Singapore

Print_ISBN

978-1-4799-2832-3

Type

conf

DOI

10.1109/EPTC.2013.6745777

Filename

6745777