DocumentCode :
3364041
Title :
Integrated circuits through the year 2010
Author :
Melliar-Smith, C.M.
Author_Institution :
AT&T Bell Labs., Breinigsville, PA, USA
fYear :
1995
fDate :
31 May-2 Jun 1995
Firstpage :
8
Lastpage :
16
Abstract :
This paper will review recent research results which have demonstrated the viability of silicon integrated circuits to sub 0.1 micron dimensions. CMOS devices, with unity gain frequencies in excess of 100 GHz have been achieved at voltages low enough (<2.0 V) to control power dissipation. Equivalent advances in packaging, CAD and testing will result in an electronics capability with a thousand fold improvement over today´s cost/performance results. The article also addresses the potential impact of these device advances on the telecommunications, computer and entertainment industries. The advent of increased bandwidth, multimedia capability and high performance computing, will create inexpensive, intelligent terminals which will increasingly become the drivers for the the consumer products market place
Keywords :
VLSI; elemental semiconductors; integrated circuit design; integrated circuit packaging; monolithic integrated circuits; silicon; technological forecasting; CAD; CMOS devices; bandwidth; intelligent terminals; monolithic integrated circuits; multimedia capability; packaging; power dissipation; submicron dimensions; unity gain frequencies; Circuit testing; Electronic equipment testing; Electronics packaging; Frequency; Integrated circuit packaging; Low voltage; Power dissipation; Silicon; Telecommunication control; Voltage control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, Systems, and Applications, 1995. Proceedings of Technical Papers. 1995 International Symposium on
Conference_Location :
Taipei
ISSN :
1524-766X
Print_ISBN :
0-7803-2773-X
Type :
conf
DOI :
10.1109/VTSA.1995.524625
Filename :
524625
Link To Document :
بازگشت