• DocumentCode
    3364041
  • Title

    Integrated circuits through the year 2010

  • Author

    Melliar-Smith, C.M.

  • Author_Institution
    AT&T Bell Labs., Breinigsville, PA, USA
  • fYear
    1995
  • fDate
    31 May-2 Jun 1995
  • Firstpage
    8
  • Lastpage
    16
  • Abstract
    This paper will review recent research results which have demonstrated the viability of silicon integrated circuits to sub 0.1 micron dimensions. CMOS devices, with unity gain frequencies in excess of 100 GHz have been achieved at voltages low enough (<2.0 V) to control power dissipation. Equivalent advances in packaging, CAD and testing will result in an electronics capability with a thousand fold improvement over today´s cost/performance results. The article also addresses the potential impact of these device advances on the telecommunications, computer and entertainment industries. The advent of increased bandwidth, multimedia capability and high performance computing, will create inexpensive, intelligent terminals which will increasingly become the drivers for the the consumer products market place
  • Keywords
    VLSI; elemental semiconductors; integrated circuit design; integrated circuit packaging; monolithic integrated circuits; silicon; technological forecasting; CAD; CMOS devices; bandwidth; intelligent terminals; monolithic integrated circuits; multimedia capability; packaging; power dissipation; submicron dimensions; unity gain frequencies; Circuit testing; Electronic equipment testing; Electronics packaging; Frequency; Integrated circuit packaging; Low voltage; Power dissipation; Silicon; Telecommunication control; Voltage control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, Systems, and Applications, 1995. Proceedings of Technical Papers. 1995 International Symposium on
  • Conference_Location
    Taipei
  • ISSN
    1524-766X
  • Print_ISBN
    0-7803-2773-X
  • Type

    conf

  • DOI
    10.1109/VTSA.1995.524625
  • Filename
    524625