Signal Integrity analysis for high speed channels in pcb/package co-design interface: 3D full wave vs. 2d/hybrid approach & full model vs. segmentation approach

This paper investigates two main concerns regarding the analysis of high speed channels for PCB/package co-design interface: 1) use of 2D/hybrid solvers vs. 3D full wave solvers and 2) segmentation approach vs. simulation of the full model. It is demonstrated that 3D EM analysis is necessary for accurate results. However, 2D/hybrid solvers can be used for preliminary post layout analysis. Several segmentation approaches are investigated for effective PCB/package co-simulation. These techniques accurately take into account the discontinuities at the PCB/package interface and render the co-simulation 2-3X less time consuming.