Title :
UV-enhanced photodetector with nanocrystalline-TiO2 thin film via CMOS compatible process
Author :
Bunjongpru, W. ; Panprom, P. ; Porntheeraphat, S. ; Meananeatra, R. ; Jeamsaksiri, W. ; Srisuwan, A. ; Chaisriratanakul, W. ; Chaowicharat, E. ; Pankiew, A. ; Hruanun, C. ; Poyai, A. ; Nukeaw, J.
Author_Institution :
Nat. Electron. & Comput. Technol. Center, Thai Microelectron. Center (TMEC), Chachoensao, Thailand
Abstract :
This research presents nanocrystal titaniumdioxide (nanocrystal-TiO2) film deposition technique with CMOS compatible process [1] to extend the optical response bandwidth of silicon based photodetecting devices toward ultraviolet range [2]. The thin films were initially deposited as Titanium Nitride (TiN) using DC magnetron reactive sputtering system. It was then annealed under nitrogen atmosphere at 800°C. After analyzing crystal structures and surface morphology with X-ray diffraction and FE-SEM systems, it was found that the deposited thin films showed the crystal phase of TiO2 oriented along (200) plane of Rutile crystal structure with 50 nm grain size and increasing with film thickness. Using electroreflectance (ER) spectroscopy measurement [3], the bandgap of nanocrystal-TiO2 was revealed to be 3.16 eV. PN-heterojunction photodiodes were fabricated with Nanocrystal-TiO2/SiO2/p-Si structures. Interdigitated aluminum structures were used as electrodes. By varying the thickness of nanocrystal-TiO2 film, i.e. 30, 60, and 90 nm, the devices could response further into the UV range. The absorption edge wavelength investigated by photoresponse measurement was at 275 nm and shifting to the shorter wavelength as a function of the nanocrystal-TiO2 grain size due to quantum confinement phenomenon [4]. The nanocrystal-TiO2/SiO2/p-Si photodetector had dark current = 5.31nA (2V), photocurrent = 0.9 uA, rise time = 58 us, fall time = 47 us at 30 nm thickness of TiO2.
Keywords :
X-ray diffraction; annealing; dark conductivity; electroreflectance; energy gap; field emission electron microscopy; grain size; nanofabrication; nanostructured materials; p-n heterojunctions; photoconductivity; photodetectors; photodiodes; scanning electron microscopy; semiconductor growth; semiconductor thin films; silicon compounds; sputter deposition; surface morphology; titanium compounds; ultraviolet detectors; wide band gap semiconductors; CMOS compatible process; DC magnetron reactive sputtering system; FESEM; PN-heterojunction photodiodes; Si; TiO2-SiO2-Si; UV-enhanced photodetector; X-ray diffraction; absorption edge wavelength; annealing; bandgap; crystal phase; dark current; electrodes; electroreflectance spectroscopy measurement; film thickness; interdigitated aluminum structure; nanocrystal grain size; nanocrystal photodetector; nanocrystal titaniumdioxide film deposition technique; nanocrystalline thin film; nitrogen atmosphere; optical response bandwidth; photocurrent; photoresponse measurement; quantum confinement phenomenon; rutile crystal structure; silicon based photodetecting devices; size 30 nm; surface morphology; temperature 800 degC; titanium nitride; Annealing; Dark current; Films; Photodetectors; Photonic band gap; Tin;
Conference_Titel :
Nanotechnology Materials and Devices Conference (NMDC), 2011 IEEE
Conference_Location :
Jeju
Print_ISBN :
978-1-4577-2139-7
DOI :
10.1109/NMDC.2011.6155377