• DocumentCode
    336438
  • Title

    Central modulation of compound motor action potential responses to epidural spinal cord stimulation

  • Author

    Sherwood, A.M. ; Lee, D.C. ; Dimitrijevic, M.R. ; Ktonas, P.Y.

  • Author_Institution
    Phys. Med. & Rehabilitation, Baylor Coll. of Med., Houston, TX, USA
  • Volume
    4
  • fYear
    1997
  • fDate
    30 Oct-2 Nov 1997
  • Firstpage
    1656
  • Abstract
    Stimulation at frequencies from 1 to 50 Hz was applied over the dorsal surface of the lumbar enlargement in spinal cord injury subjects. Low-frequency responses appeared that were similar to compound motor action potentials (CMAPs) evoked by peripheral nerve stimulation. Close examination of the EMG response to higher frequencies (30-50 Hz) revealed that the EMG was comprised of a series of CMAPs of varying shape and amplitude. Under appropriate conditions, a constant train of stimuli evoked cyclic bursting activity. Examination of the characteristics of that activity revealed that intra-burst and burst phases were comprised of CMAPs of very different morphologies with markedly different latencies. These findings suggest that stimulation-induced activity was processed through different pathways, depending on the system state
  • Keywords
    electromyography; frequency response; modulation; neuromuscular stimulation; 1 to 50 Hz; CMAP latency; CMAP morphology; EMG response; compound motor action potentials; cyclic bursting activity; epidural spinal cord stimulation; intra-burst phase; low-frequency responses; lumbar enlargement dorsal surface; peripheral nerve stimulation; response modulation; spinal cord injury; stimulation-induced activity; system state; Delay; Educational institutions; Electrical stimulation; Electrodes; Electromyography; Frequency; Muscles; Spinal cord; Spinal cord injury; Surface morphology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 1997. Proceedings of the 19th Annual International Conference of the IEEE
  • Conference_Location
    Chicago, IL
  • ISSN
    1094-687X
  • Print_ISBN
    0-7803-4262-3
  • Type

    conf

  • DOI
    10.1109/IEMBS.1997.757037
  • Filename
    757037