An effective approach for failure analysis of neighbour pin leakage caused by nano layer metallic thin film in LQFP fine pitch packages

Fine pitch LQFP package microcontroller is having a tighter leakage requirement in nano ampere range. The source of the leakage could be very minute in physical dimension. Therefore the failure analysis approach should be planned tactfully to ensure proper detection of the failure mode. This paper studied an effective approach for physical cause characterization in a case of neighbor pin leakage associated with the nano layer metallic thin film on the kapton tape of LQFP fine pitch packages.