DocumentCode
336473
Title
New methods and parameters for dynamic foot pressure analysis in diabetic neuropathy
Author
Patil, M.K. ; Bhat, Vasanth M. ; Bhati, Mahesh M. ; Parivalavan, R. ; Narayanamurthy, B.V. ; Ganesan, V.S.
Author_Institution
Dept. of Appl. Mech., Indian Inst. of Technol., Madras, India
Volume
4
fYear
1997
fDate
30 Oct-2 Nov 1997
Firstpage
1826
Abstract
Walking foot pressures are found to be affected by the weight of the person and walking velocity. It is found that both the magnitude and duration of the dynamic foot pressures are important in ulcer formation in neuropathic feet. This paper describes a method of using new parameters: Normalized Peak Pressure (NPP), and Pressure Contact Ratio (PCR) to understand pressure distribution patterns under the soles of diabetic subjects with neuropathic feet possibly responsible for ulcer formation. The measurement of dynamic foot pressure, on normals as well as 3 classes of diabetic subjects, is carried out using optical pedobarograph. The foot is divided into ten areas and they are scanned to find maximum values of the new parameters in each of these areas. A statistical study of the foot pressure parameters for normals and three classes of diabetic patients indicate distinguishing trends and hence could possibly provide a quantitative insight into the condition of the foot to the clinician and may aid in better diagnosis and therapy planning
Keywords
bio-optics; biomechanics; biomedical measurement; pressure measurement; diabetic neuropathy; dynamic foot pressure analysis; normalized peak pressure; optical pedobarograph; pressure contact ratio; pressure distribution patterns; therapy planning; ulcer formation; walking foot pressures; walking velocity; Biomedical engineering; Diabetes; Foot; Image converters; Legged locomotion; Medical diagnostic imaging; Medical treatment; Optical transmitters; Pathology; Pressure measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 1997. Proceedings of the 19th Annual International Conference of the IEEE
Conference_Location
Chicago, IL
ISSN
1094-687X
Print_ISBN
0-7803-4262-3
Type
conf
DOI
10.1109/IEMBS.1997.757085
Filename
757085
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