MEMS phased array detection in contact with solids

Author

Greve, D.W. ; Jain, A. ; Oppenheim, I.J.

Author_Institution

Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA

Volume

2

fYear

2002

fDate

8-11 Oct. 2002

Firstpage

1035

Abstract

We report on the development of transducers for ultrasonic flaw detection which can be permanently mounted at critical locations on structures. We will show that MEMS capacitive diaphragm transducers can be bonded to metal or plexiglas test specimens without damage and that ultrasonic energy can be efficiently coupled into the transducer. It will be demonstrated that transducer arrays can be operated as a phased array in order to determine the direction and distance of an ultrasonic source. In addition, the detection of flaws or voids in a test specimen will also be demonstrated.

Keywords

capacitive sensors; diaphragms; flaw detection; microsensors; plastics; ultrasonic materials testing; ultrasonic transducer arrays; voids (solid); MEMS capacitive diaphragm transducers; MEMS phased array detection; critical locations; flaws; metal test specimens; plexiglas test specimens; ultrasonic flaw detection; voids; Acoustic transducers; Bonding; Detectors; Frequency; Micromechanical devices; Phase detection; Phased arrays; Solids; Ultrasonic transducer arrays; Ultrasonic transducers;

fLanguage

English

Publisher

ieee

Conference_Titel

Ultrasonics Symposium, 2002. Proceedings. 2002 IEEE

ISSN

1051-0117

Print_ISBN

0-7803-7582-3

Type

conf

DOI

10.1109/ULTSYM.2002.1192472

Filename

1192472