DocumentCode :
3364926
Title :
MEMS phased array detection in contact with solids
Author :
Greve, D.W. ; Jain, A. ; Oppenheim, I.J.
Author_Institution :
Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Volume :
2
fYear :
2002
fDate :
8-11 Oct. 2002
Firstpage :
1035
Abstract :
We report on the development of transducers for ultrasonic flaw detection which can be permanently mounted at critical locations on structures. We will show that MEMS capacitive diaphragm transducers can be bonded to metal or plexiglas test specimens without damage and that ultrasonic energy can be efficiently coupled into the transducer. It will be demonstrated that transducer arrays can be operated as a phased array in order to determine the direction and distance of an ultrasonic source. In addition, the detection of flaws or voids in a test specimen will also be demonstrated.
Keywords :
capacitive sensors; diaphragms; flaw detection; microsensors; plastics; ultrasonic materials testing; ultrasonic transducer arrays; voids (solid); MEMS capacitive diaphragm transducers; MEMS phased array detection; critical locations; flaws; metal test specimens; plexiglas test specimens; ultrasonic flaw detection; voids; Acoustic transducers; Bonding; Detectors; Frequency; Micromechanical devices; Phase detection; Phased arrays; Solids; Ultrasonic transducer arrays; Ultrasonic transducers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium, 2002. Proceedings. 2002 IEEE
ISSN :
1051-0117
Print_ISBN :
0-7803-7582-3
Type :
conf
DOI :
10.1109/ULTSYM.2002.1192472
Filename :
1192472
Link To Document :
بازگشت