• DocumentCode
    3364974
  • Title

    Composite MLCCs with X7R characteristics

  • Author

    Gui, Zhilun ; Cai, Hong ; Li, Longtu

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Tsinghua Univ., Beijing, China
  • Volume
    2
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    821
  • Abstract
    The low-sintering composite multilayer ceramic capacitors (CMLCCs) having K-value in excess of 7200 with X7R characteristics (-55~+125°C, ±15%) have been successfully developed. The CMLCCs incorporate four PMN-PNN-PT or PMN-PT based ceramics with different Curie temperatures as the principal components. The green tapes and inner electrodes are stacked during green printing according to a certain order and cofired to prepare this kind of multi-material multilayer chip component. According to the parallel-connecting model of capacitance, the dielectric constant (K) of CMLCC can be approximately determined by the proportion of four dielectrics with different Curie temperatures. The small difference between the calculative curve and testing curve can be explained by the mutual diffusion among different dielectrics via the inner electrode. The research results show that it is feasible to produce chip components with high performance by cofiring multi-phases materials
  • Keywords
    ceramic capacitors; ferroelectric Curie temperature; ferroelectric capacitors; ferroelectric ceramics; permittivity; sintering; -55 to 125 C; Curie temperatures; K-value; PMN-PNN-PT based ceramics; PMN-PT based ceramics; X7R characteristics; composite MLCCs; dielectric constant; dielectrics; green tapes; inner electrode; low-sintering multilayer ceramic capacitors; multi-material multilayer chip component; mutual diffusion; parallel connecting model of capacitance; stacked; Capacitance; Capacitors; Ceramics; Dielectric constant; Dielectric materials; Electrodes; Nonhomogeneous media; Printing; Temperature; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applications of Ferroelectrics, 2000. ISAF 2000. Proceedings of the 2000 12th IEEE International Symposium on
  • Conference_Location
    Honolulu, HI
  • ISSN
    1099-4734
  • Print_ISBN
    0-7803-5940-2
  • Type

    conf

  • DOI
    10.1109/ISAF.2000.942444
  • Filename
    942444