DocumentCode
3365133
Title
Modeling of microstrip dispersion in FD-TD analysis for HTSC applications
Author
Williams, D.C. ; Rawat, B.S.
Author_Institution
Dept. of Electr. Eng., Nevada Univ., Reno, NV, USA
Volume
3
fYear
1994
fDate
20-24 June 1994
Firstpage
1722
Abstract
Dispersion in microstrip lines is readily apparent under finite difference-time domain analysis methods. Although the mathematical rigor of such methods provides an accurate representation of system performance for normal conductors, modeling of dispersion-free high temperature superconducting structures requires an appropriate correction to eliminate this effect. A model is proposed whereby the effective substrate permittivity may be adjusted to compensate for the absence of dispersion at higher frequencies.
Keywords
finite difference time-domain analysis; high-temperature superconductors; microstrip lines; permittivity; substrates; superconducting microwave devices; FD-TD analysis; HTSC applications; dispersion-free high temperature superconducting structures; finite difference-time domain analysis; microstrip dispersion modeling; substrate permittivity; system performance; Boundary conditions; Conducting materials; Dispersion; Frequency dependence; High temperature superconductors; Microstrip; Permittivity; Planar transmission lines; Strips; Superconducting transmission lines;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation Society International Symposium, 1994. AP-S. Digest
Conference_Location
Seattle, WA, USA
Print_ISBN
0-7803-2009-3
Type
conf
DOI
10.1109/APS.1994.408117
Filename
408117
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