• DocumentCode
    3365133
  • Title

    Modeling of microstrip dispersion in FD-TD analysis for HTSC applications

  • Author

    Williams, D.C. ; Rawat, B.S.

  • Author_Institution
    Dept. of Electr. Eng., Nevada Univ., Reno, NV, USA
  • Volume
    3
  • fYear
    1994
  • fDate
    20-24 June 1994
  • Firstpage
    1722
  • Abstract
    Dispersion in microstrip lines is readily apparent under finite difference-time domain analysis methods. Although the mathematical rigor of such methods provides an accurate representation of system performance for normal conductors, modeling of dispersion-free high temperature superconducting structures requires an appropriate correction to eliminate this effect. A model is proposed whereby the effective substrate permittivity may be adjusted to compensate for the absence of dispersion at higher frequencies.
  • Keywords
    finite difference time-domain analysis; high-temperature superconductors; microstrip lines; permittivity; substrates; superconducting microwave devices; FD-TD analysis; HTSC applications; dispersion-free high temperature superconducting structures; finite difference-time domain analysis; microstrip dispersion modeling; substrate permittivity; system performance; Boundary conditions; Conducting materials; Dispersion; Frequency dependence; High temperature superconductors; Microstrip; Permittivity; Planar transmission lines; Strips; Superconducting transmission lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium, 1994. AP-S. Digest
  • Conference_Location
    Seattle, WA, USA
  • Print_ISBN
    0-7803-2009-3
  • Type

    conf

  • DOI
    10.1109/APS.1994.408117
  • Filename
    408117