DocumentCode
3365186
Title
Ultra Wide Band Band Pass filter embedding a MLF low cost package with wire bound attach process
Author
Cubillo, J.R. ; Gaubert, J. ; Bourdel, S. ; Barthélémy, H. ; Battista, M. ; Egels, Matthieu
Author_Institution
L2MP, Marseille
fYear
2007
fDate
11-14 Dec. 2007
Firstpage
939
Lastpage
942
Abstract
In this paper we propose a design methodology to synthesize a band pass (BP) filter while embedding a package transition using wire bound attach process. The BP filter uses quarter wave coplanar line at the PCB level, the package transition and passive elements on DIE. The BP filter is designed for a low noise amplifier (LNA) receiver in the ECC-UWB band (6-8,5 GHz).
Keywords
band-pass filters; coplanar transmission lines; integrated circuit packaging; low noise amplifiers; receivers; PCB; low noise amplifier receiver; micro lead frame package; quarter wave coplanar line; ultra wide band band pass filter; wire bound attach process; Band pass filters; Costs; Dielectric losses; Inductance; Packaging; Passive filters; Shunt (electrical); Transmission line matrix methods; Ultra wideband technology; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics, Circuits and Systems, 2007. ICECS 2007. 14th IEEE International Conference on
Conference_Location
Marrakech
Print_ISBN
978-1-4244-1377-5
Electronic_ISBN
978-1-4244-1378-2
Type
conf
DOI
10.1109/ICECS.2007.4511146
Filename
4511146
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