DocumentCode :
3365216
Title :
Fabrication of low cost spherical alkali atom vapor cells by combining a low temperature anodic bonding and a Chemical Foaming Process (CFP)
Author :
Youpeng Chen ; Jintang Shang ; Yu Ji
Author_Institution :
Key Lab. of MEMS of Minist. of Educ., Southeast Univ., Nanjing, China
fYear :
2013
fDate :
11-13 Dec. 2013
Firstpage :
809
Lastpage :
812
Abstract :
In this presentation, a novel fabrication process, based on our previous research [4-5], used to manufacture spherical alkali atom vapor cells for miniaturized atomic clock application will be presented, allowing low-cost wafer level batch fabrication and assembly. This method combines low temperature anodic bonding technique and Chemical Foaming Process (CFP) for producing spherical alkali atom vapor cells. The Rb (Rubidium) vapor cell, which consists of two cavities, has been carefully designed. The smaller one which taken as reaction chamber connected to the larger one which served as a working chamber with micro-channel can prevent reactant from entering into working chamber improves the purity of Rb in the working chamber. The fabrication is based on UV laser equipment, and then a thin Pyrex7740 glass wafer is anodic bonded to the patterned silicon wafer. Subsequently, the bonded wafer is heated over the softening point of the glass (Tg=821°C) and hydrogen gas released by TiH2 blowing the glass into spherical shells. During this process the reaction take place and produce rubidium vapor which through microchannel to enter working chamber. The Rb vapor cell is characterized by EDS (Energy Dispersive Spectroscopy) and ultraviolet spectrophotometer. Results show that during fabrication process the rubidium produced and Rb vapor cell is fabricated successfully.
Keywords :
anodisation; atomic clocks; bonding processes; hermetic seals; rubidium; spectrophotometers; wafer bonding; Rb; UV laser equipment; chemical foaming process; energy dispersive spectroscopy; hydrogen gas; low cost spherical alkali atom vapor cells; low cost wafer level batch fabrication; low temperature anodic bonding; microchannel; miniaturized atomic clock application; reaction chamber; temperature 821 degC; thin glass wafer; ultraviolet spectrophotometer; working chamber; Conferences; Decision support systems; Electronics packaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th
Conference_Location :
Singapore
Print_ISBN :
978-1-4799-2832-3
Type :
conf
DOI :
10.1109/EPTC.2013.6745833
Filename :
6745833
Link To Document :
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