Application specific teletext-a new modular approach

A new systems approach to teletext decoder design has been developed which takes advantage of the integration capabilities of 1 micron CMOS technology, coupled with powerful ASIC design techniques. A result of this approach has been the implementation of the teletext decoding function within a single chip. This chip, incorporating high performance digital, analog and memory circuitry, was fabricated using Texas Instruments´ standard Epic 1A 1-micron CMOS process. Using the same Epic 1A process, an analog interface chip, CF72303, was also developed to provide the teletext data slicing, clock regeneration and sync separation functions. This chip also combines together analog and digital circuitry within a single 5 volt supply solution.<>