• DocumentCode
    3365379
  • Title

    High performance integrated passive devices (ipds) on low cost through silicon interposer (LC-TSI)

  • Author

    Cheng Jin ; Boyu Zheng ; Liang Ding ; Rui Li ; Kafai Chang

  • Author_Institution
    Inst. of Microelectron., Agency for Sci., Technol. & Res. (A*STAR, Singapore, Singapore
  • fYear
    2013
  • fDate
    11-13 Dec. 2013
  • Firstpage
    840
  • Lastpage
    843
  • Abstract
    This paper presents the design, fabrication and characterization of integrated passive devices (IPDs) on low cost through silicon interposer (LC-TSI). The performance of symmetrical spiral inductors is presented and analyzed in this paper. The effect of space between traces and the width of the trace on the Q-factor are studied. In addition, the inductors with TSV around and under are also discussed. On the TSI platform, some radio-frequency (RF) IPDs are also designed, including a millimeter-wave (mmWave) antenna working at 77 GHz for the automotive radar application. A bandpass filter based on the quarter-mode substrate integrated waveguide (QMSIW) is also designed on the TSI platform. The performance of these structures is given and the results show that the TSI platform is an attractive and promising method as a carrier to design IPDs and RF-IPD working at high frequency.
  • Keywords
    band-pass filters; inductors; millimetre wave antennas; road vehicle radar; substrate integrated waveguides; three-dimensional integrated circuits; LC-TSI; Q-factor; QMSIW; RF IPD; automotive radar application; bandpass filter; frequency 77 GHz; high performance integrated passive devices; low cost through silicon interposer; millimeter-wave antenna; mmWave antenna; quarter-mode substrate integrated waveguide; radiofrequency IPD; symmetrical spiral inductors; Antennas; Band-pass filters; Inductors; Q-factor; Silicon; Substrates; Through-silicon vias; Bandpass filter (BPF); integrated passive device (IPD); low-cost through silicon interposer (LC-TSI) millimetre-wave (mmWave);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4799-2832-3
  • Type

    conf

  • DOI
    10.1109/EPTC.2013.6745840
  • Filename
    6745840