Novel high performance millimeter-wave resonator and filter structures using embedded wafer level packaging (EWLP) technology

Author

Rui Li ; Boo Yang Jung ; Cheng Jin ; Chang Ka Fai ; Soon Wee Ho ; Velez Sorono, Dexter

Author_Institution

Inst. of Microelectron., Agency for Sci., Technol. & Res. (A*STAR), Singapore, Singapore

fYear

2013

fDate

11-13 Dec. 2013

Firstpage

844

Lastpage

847

Abstract

In this paper, a 60 GHz resonator is designed and implemented on embedded wafer level packaging (EWLP) platform. The resonator is constructed in substrate integrated waveguide (SIW) configuration with the molding compound as the filled in substrate material. Through molding vias (TMVs) are employed to realize the via fences and the top and bottom redistribution layers (RDLs) serve as the top and bottom metallic walls. The resonator exhibits a quality factor (Q-factor) of 88. The resonator is subsequently used to form a second-order bandpass filter by cascading two such resonators in a line. The insertion loss of the bandpass filter is smaller than 4.15 dB, and the return loss is larger than 12.95 dB. The fractional bandwidth is 3.5% at 59.20Hz.

Keywords

Q-factor; band-pass filters; millimetre wave filters; millimetre wave resonators; substrate integrated waveguides; wafer level packaging; EWLP platform; Q-factor; RDL; SIW configuration; TMV; bandwidth 59.20 GHz; bottom metallic walls; bottom redistribution layers; embedded wafer level packaging technology; filter structures; frequency 60 GHz; high performance millimeter-wave resonator; molding compound; quality factor; second-order bandpass filter; substrate integrated waveguide configuration; substrate material; through molding vias; top metallic walls; top redistribution layers; Conferences; Decision support systems; Electronics packaging; Bandpass filter (BPF); embedded wafer level packaging (EWLP); millimetre-wave (mm-wave); resonator; substrate integrated waveguide (SIW); through molding via (TMV);

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th

Conference_Location

Singapore

Print_ISBN

978-1-4799-2832-3

Type

conf

DOI

10.1109/EPTC.2013.6745841

Filename

6745841