Novel high performance millimeter-wave resonator and filter structures using embedded wafer level packaging (EWLP) technology

In this paper, a 60 GHz resonator is designed and implemented on embedded wafer level packaging (EWLP) platform. The resonator is constructed in substrate integrated waveguide (SIW) configuration with the molding compound as the filled in substrate material. Through molding vias (TMVs) are employed to realize the via fences and the top and bottom redistribution layers (RDLs) serve as the top and bottom metallic walls. The resonator exhibits a quality factor (Q-factor) of 88. The resonator is subsequently used to form a second-order bandpass filter by cascading two such resonators in a line. The insertion loss of the bandpass filter is smaller than 4.15 dB, and the return loss is larger than 12.95 dB. The fractional bandwidth is 3.5% at 59.20Hz.