• DocumentCode
    3365486
  • Title

    Investigating the thermal stability of 1-3 piezoelectric composite transducers by varying the thermal conductivity and glass transition temperature of the polymeric filler material

  • Author

    Parr, A.C.S. ; O´Leary, Richard L. ; Hayward, Gordon ; Benny, S. ; Ewing, H. ; Mackintosh, A.R.

  • Author_Institution
    Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
  • Volume
    2
  • fYear
    2002
  • fDate
    8-11 Oct. 2002
  • Firstpage
    1173
  • Abstract
    The thermal behaviour of a number of 1-3 piezoelectric composite transducers is discussed. In particular, devices manufactured from a polymer filler with a relatively high glass to rubber transition temperature (Tg), and from polymer systems with increased thermal conductivity, are evaluated. The mechanical properties of the various filler materials were obtained via ultrasonic measurements, with the thermal properties extracted using dynamic mechanical thermal analysis (dmta), differential scanning calorimetry (dsc) and laserflash studies. A range of ultrasonic transducers were then constructed and their thermal stability studied using a combination of impedance analysis and laser surface displacement measurement.
  • Keywords
    filled polymers; glass transition; piezoelectric transducers; thermal analysis; thermal conductivity; thermal stability; ultrasonic transducers; 1-3 piezoelectric composite transducer; differential scanning calorimetry; dynamic mechanical thermal analysis; glass transition temperature; impedance analysis; laser flash technique; laser surface displacement measurement; mechanical properties; polymeric filler material; thermal conductivity; thermal properties; thermal stability; ultrasonic transducer; Composite materials; Conducting materials; Glass; Piezoelectric materials; Piezoelectric transducers; Polymers; Temperature; Thermal conductivity; Thermal stability; Ultrasonic transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2002. Proceedings. 2002 IEEE
  • ISSN
    1051-0117
  • Print_ISBN
    0-7803-7582-3
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2002.1192502
  • Filename
    1192502