DocumentCode
336560
Title
Quantitative and imaging performance of uncooled microbolometer sensors for medical applications
Author
Marshall, Charles A. ; Breen, Thomas ; Kohin, Margaret ; Watson, Walter ; Murphy, Robert ; Bultler, N.R. ; Parker, T.W. ; Perich, Lou
Author_Institution
Lockheed Martin Imaging Syst., Lexington, MA, USA
Volume
2
fYear
1997
fDate
30 Oct-2 Nov 1997
Firstpage
718
Abstract
Lockheed Martin IR Imaging Systems is developing low cost, high performance, uncooled infrared imaging products for both military and commercial applications. These products are based on the microbolometer technology, a silicon micromachined sensor that combines wafer level silicon processing with a device structure capable of yielding excellent imaging performance. Here, the authors report on the latest technical improvements and performance of an uncooled sensor as measured through laboratory and field testing. The performance of the authors´ uncooled sensor has been measured to determine sensor capabilities for insertion into both military and commercial products. Linearity of the sensor over a scene temperature range of 95°C is less than 0.5%. The authors´ sensors typically have temporal NETDs of less than 70 mK as well as spatial NETDs of less than 50 mK. MRTD performance is less than 0.4°C at spatial frequencies more than 20% beyond Nyquist. Sensor stability over time has been measured and found to meet both commercial and military requirements. Spatial noise over a wide scene temperature range is reported as well as other test results. Video is used to demonstrate sensor performance capabilities in a variety of applications
Keywords
biomedical equipment; biomedical imaging; bolometers; infrared imaging; Lockheed Martin IR Imaging Systems; Nyquist; commercial products; device structure; field testing; imaging performance; laboratory testing; medical instrumentation; military products; scene temperature range; sensor performance capabilities; sensor stability; silicon micromachined sensor; technical improvements; uncooled microbolometer sensors; wafer level silicon processing; Costs; Image sensors; Infrared imaging; Layout; Linearity; Optical imaging; Silicon; Temperature distribution; Temperature sensors; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 1997. Proceedings of the 19th Annual International Conference of the IEEE
Conference_Location
Chicago, IL
ISSN
1094-687X
Print_ISBN
0-7803-4262-3
Type
conf
DOI
10.1109/IEMBS.1997.757736
Filename
757736
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