Residual stresses in the electrode of Pt/Ti for the thermal detector with thin-film structure

Author

Kim, Kibeom ; Yoo, Mina ; Lee, Sangil ; Kim, Dohoon ; Bae, Seongho ; Lee, Moonho

Author_Institution

Dept. of Appl. Electron., Yeungnam Univ., Kyungsan, South Korea

Volume

2

fYear

2000

fDate

2000

Firstpage

929

Abstract

Residual stress of Pt/Ti thin film electrode was investigated as a function of substrate temperature by using of XRD and SEM. In order to develop the residual stress, stress sensitive structures of Pt/Ti thin film on SiO₂/Si(substrate) were fabricated. Thermally induced residual stress, which was originated in the different thermal expansion coefficients between film and substrate, was led to the dimensional change of overall structure. XRD results confirmed the existence of internal stresses on Pt/Ti thin film

Keywords

X-ray diffraction; internal stresses; metallic thin films; platinum; scanning electron microscopy; thermal expansion; titanium; Pt-Ti; Pt/Ti; SEM; SiO₂-Si; XRD; residual stresses; stress sensitive structures; thermal detector; thermal expansion coefficients; thin-film structure; Annealing; Detectors; Electrodes; Grain size; Residual stresses; Substrates; Temperature; Thermal stresses; Transistors; X-ray scattering;

fLanguage

English

Publisher

ieee

Conference_Titel

Applications of Ferroelectrics, 2000. ISAF 2000. Proceedings of the 2000 12th IEEE International Symposium on

Conference_Location

Honolulu, HI

ISSN

1099-4734

Print_ISBN

0-7803-5940-2

Type

conf

DOI

10.1109/ISAF.2000.942470

Filename

942470