DocumentCode :
3365932
Title :
The Relationship between Organizational Career Management and Job Satisfaction: An Empirical Study on Software R&D Professionals
Author :
Wu Wenhua
Author_Institution :
Sch. of Manage., Hunan Univ., Changsha
fYear :
2008
fDate :
4-6 Nov. 2008
Firstpage :
593
Lastpage :
598
Abstract :
The primary purpose of this paper is to explore the relationship between organizational career management (OCM) and job satisfaction (JS). The measurements we used were the OCM scale developed by Long Lirong and JS scale developed by Smith et al. We conducted questionnaires survey in twelve software enterprises in China and acquired a sample of 141. The results showed that the correlation between OCM as a whole and JS, as well as the correlation between each dimension of OCM and JS, was significant. Among the OCM dimensions, the "Vocational Cognizance" is most correlated with the JS while "Fair Career Promotion" is least correlated. And the demographical variables have certain impacts over the correlation between software R&D professionals\´ perception toward OCM and their JS. The conclusion was that our software enterprises could increase R&D professionals\´ job satisfaction though improving OCM level, serving to lower the turnover rate of software R&D professionals and to offer guarantee for the stable and fast development of software industry.
Keywords :
DP industry; human resource management; organisational aspects; research and development; China; job satisfaction; organizational career management; software R&D professionals; software enterprises; software industry; Career development; Companies; Computer industry; Conference management; Engineering management; Engineering profession; Humans; Research and development; Research and development management; Risk management; Career development; Job satisfaction; Organizational career management; Software R&D professionals;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Risk Management & Engineering Management, 2008. ICRMEM '08. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-0-7695-3402-2
Type :
conf
DOI :
10.1109/ICRMEM.2008.61
Filename :
4673297
Link To Document :
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