DocumentCode
3366460
Title
Cellular approach to improve the haemocompatibility of blood contacting medical devices
Author
Benmakroha, Yazid M. ; Zhang, Sifu ; Wisman, Mike ; Rolfe, Peter
Author_Institution
Dept. of Biomed. Eng. & Med. Phys., Keele Univ., UK
Volume
5
fYear
1996
fDate
31 Oct-3 Nov 1996
Firstpage
2063
Abstract
A novel copolymer, 2-methacryloyloxyethyl phosphorylcholine (MPC) when coated onto polyvinyl chloride tubing showed a significant reduction in the adsorption of protein compared to polyvinyl chloride tubing without MPC coating. Both experiments were performed under static conditions in contact with blood. The same experiment was repeated under haemodynamic conditions (exposed to flow). Thrombus formation was observed on the surface layer. The second approach was using human umbilical vein endothelial cells (HUVEC). An in-vitro pulsatile flow circuit was designed and developed to assess the effect of endothelial cell seeding on the outer side edge of the polyvinyl chloride. The PVC cubing seeded with HUVEC was exposed to 16 dynes/cm2 shear stress for period of 24 hours, placed in whole fresh blood, and then fixed. Results expressed through a scanning electron micrograph shows a confluent tight-linked monolayer of endothelium is evident on the polyvinyl chloride and no thrombus formation was noted
Keywords
biomedical equipment; blood; cellular biophysics; 2-methacryloyloxyethyl phosphorylcholine; 24 h; blood contacting medical devices; copolymer; haemocompatibility improvement; human umbilical vein endothelial cells; in-vitro pulsatile flow circuit; polyvinyl chloride tubing; protein adsorption reduction; scanning electron micrograph; thrombus formation; tight-linked endothelium monolayer; whole fresh blood; Adhesives; Biomedical engineering; Blood; Cells (biology); Circuit testing; Humans; In vitro; Physics; Protein engineering; Veins;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 1996. Bridging Disciplines for Biomedicine. Proceedings of the 18th Annual International Conference of the IEEE
Conference_Location
Amsterdam
Print_ISBN
0-7803-3811-1
Type
conf
DOI
10.1109/IEMBS.1996.646433
Filename
646433
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