Title :
Long-term reliability evaluation of power semiconductor devices used in substation rectifiers
Author :
Horiuchi, Toshikazu ; Sugawara, Yoshitaka
Author_Institution :
Kansai Electr. Power Co. Inc., Hyogo, Japan
Abstract :
To enable evaluation of the long-term reliability of power semiconductor devices used in commercial substations, this paper presents the failure rate of such devices in practical use. Recovery activation energies are also evaluated on the basis of annealing and bias stress test. Degraded devices are disassembled and examined. In some of them, melting and defects at the silicon chip edge caused a large leakage current. It is also found that the leakage current spectrum is strongly related to breakdown voltage degradation. A novel monitoring method using the leakage current spectrum is proposed here for the first time
Keywords :
annealing; failure analysis; leakage currents; melting; monitoring; power semiconductor diodes; rectifier substations; semiconductor device reliability; semiconductor device testing; solid-state rectifiers; Si; annealing; bias stress test; breakdown voltage degradation; degraded device disassembly; degraded devices; failure rate; leakage current; leakage current spectrum; long-term reliability; monitoring method; power semiconductor devices; recovery activation energy; silicon chip edge defects; silicon chip edge melting; substation rectifiers; substations; Annealing; Degradation; Leakage current; Monitoring; Power semiconductor devices; Semiconductor device reliability; Silicon; Stress; Substations; Testing;
Conference_Titel :
Power Semiconductor Devices and ICs, 1998. ISPSD 98. Proceedings of the 10th International Symposium on
Conference_Location :
Kyoto
Print_ISBN :
0-7803-4752-8
DOI :
10.1109/ISPSD.1998.702667