DocumentCode
3366561
Title
Using an inverted FMEA to manage change and reduce risk in a FAB
Author
Trahan, Robert ; Pollock, Anthony
Author_Institution
White Oak Semicond., Sandston, VA, USA
fYear
1999
fDate
1999
Firstpage
15
Lastpage
18
Abstract
This paper presents a Change Management System which incorporates the elements found in most semiconductor factories. They include the following: A Change Review Board; Checklist of characterization techniques; Specifications to guide engineers; Documentation and Communication of the Changes. The integral element of this system is the formal use of an inverted FMEA to guide the change agent to the appropriate evaluation methodology and qualification plan. Use of this method is found to be effective at preventing scrap and minimizing risk to the product performance
Keywords
integrated circuit manufacture; management of change; risk management; change management; inverted FMEA; risk management; semiconductor fab; Circuits; Documentation; Doping; Lamps; Manufacturing processes; Monitoring; Production facilities; Risk management; Tiles; USA Councils;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on
Conference_Location
Santa Clara, CA
ISSN
1523-553X
Print_ISBN
0-7803-5403-6
Type
conf
DOI
10.1109/ISSM.1999.808727
Filename
808727
Link To Document