• DocumentCode
    3366561
  • Title

    Using an inverted FMEA to manage change and reduce risk in a FAB

  • Author

    Trahan, Robert ; Pollock, Anthony

  • Author_Institution
    White Oak Semicond., Sandston, VA, USA
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    15
  • Lastpage
    18
  • Abstract
    This paper presents a Change Management System which incorporates the elements found in most semiconductor factories. They include the following: A Change Review Board; Checklist of characterization techniques; Specifications to guide engineers; Documentation and Communication of the Changes. The integral element of this system is the formal use of an inverted FMEA to guide the change agent to the appropriate evaluation methodology and qualification plan. Use of this method is found to be effective at preventing scrap and minimizing risk to the product performance
  • Keywords
    integrated circuit manufacture; management of change; risk management; change management; inverted FMEA; risk management; semiconductor fab; Circuits; Documentation; Doping; Lamps; Manufacturing processes; Monitoring; Production facilities; Risk management; Tiles; USA Councils;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1523-553X
  • Print_ISBN
    0-7803-5403-6
  • Type

    conf

  • DOI
    10.1109/ISSM.1999.808727
  • Filename
    808727