Product mix planning in semiconductor manufacturing

Author

I-Hsuan Hong ; Chou, Y.-C. ; Kuo, C.-Y. ; Lu, L.-C.

Author_Institution

Nat. Taiwan Univ., Taipei, Taiwan

fYear

1999

fDate

1999

Firstpage

19

Lastpage

22

Abstract

To cope with product demand and price fluctuations and rapid technology transition, many semiconductor manufacturers have broadened their product scope to wider ranges of memory and logic devices in recent year´s. Product mix planning emerges as a critical business capability to exploit market opportunities. This paper focuses on product mix planning in a foundry manufacturing environment. Issues discussed include levels of planning granularity, mix planning and bottleneck-based analysis. A software system has been implemented that provides both product mix solutions and sensitivity information of product price and tool capacity. Used as a planning tool, the system will improve fab agility under dynamic market conditions

Keywords

integrated circuit manufacture; planning; bottleneck analysis; foundry manufacturing; granularity; logic device; memory device; product mix planning; semiconductor fab; software system; Capacity planning; Cost accounting; Fluctuations; Logic devices; Portfolios; Process planning; Production planning; Routing; Semiconductor device manufacture; Software tools;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on

Conference_Location

Santa Clara, CA

ISSN

1523-553X

Print_ISBN

0-7803-5403-6

Type

conf

DOI

10.1109/ISSM.1999.808728

Filename

808728