DocumentCode :
3366606
Title :
Product mix planning in semiconductor manufacturing
Author :
I-Hsuan Hong ; Chou, Y.-C. ; Kuo, C.-Y. ; Lu, L.-C.
Author_Institution :
Nat. Taiwan Univ., Taipei, Taiwan
fYear :
1999
fDate :
1999
Firstpage :
19
Lastpage :
22
Abstract :
To cope with product demand and price fluctuations and rapid technology transition, many semiconductor manufacturers have broadened their product scope to wider ranges of memory and logic devices in recent year´s. Product mix planning emerges as a critical business capability to exploit market opportunities. This paper focuses on product mix planning in a foundry manufacturing environment. Issues discussed include levels of planning granularity, mix planning and bottleneck-based analysis. A software system has been implemented that provides both product mix solutions and sensitivity information of product price and tool capacity. Used as a planning tool, the system will improve fab agility under dynamic market conditions
Keywords :
integrated circuit manufacture; planning; bottleneck analysis; foundry manufacturing; granularity; logic device; memory device; product mix planning; semiconductor fab; software system; Capacity planning; Cost accounting; Fluctuations; Logic devices; Portfolios; Process planning; Production planning; Routing; Semiconductor device manufacture; Software tools;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on
Conference_Location :
Santa Clara, CA
ISSN :
1523-553X
Print_ISBN :
0-7803-5403-6
Type :
conf
DOI :
10.1109/ISSM.1999.808728
Filename :
808728
Link To Document :
بازگشت