Title :
Integration of 300 mm fab layouts and material handling automation
Author :
Pillai, Devadas ; Quinn, Tim ; Kryder, Ken ; Charlson, Dan
Author_Institution :
Intel Corp., Chandler, AZ, USA
Abstract :
We present key approaches and methodologies from Intel´s 300 mm factory integration efforts. The topics discussed in this paper are aimed at cross-functional optimization of fab layouts, automated material handling systems (AMHS) and operations. We discuss the key benefits of up front understanding of the interactions and investigate specific attributes in layouts and AMHS configurations where the integrated design/analysis is addressing cost-benefits and flexibility trade-offs needed in the high volume 300 mm factories
Keywords :
integrated circuit manufacture; materials handling; 300 mm; Intel; automated material handling system; cross-functional optimization; factory integration; high volume manufacturing; semiconductor fab layout; Automation; Costs; Ergonomics; Frequency; Materials handling; Optimization methods; Pain; Production facilities; Throughput; Vehicles;
Conference_Titel :
Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on
Conference_Location :
Santa Clara, CA
Print_ISBN :
0-7803-5403-6
DOI :
10.1109/ISSM.1999.808729
