• DocumentCode
    3366779
  • Title

    Dynamic dispatch and graphical monitoring system

  • Author

    Pierce, Neal G. ; Yurtsever, Tanju

  • Author_Institution
    Adv. Products Res. & Dev. Lab., Motorola Inc., Austin, TX, USA
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    65
  • Lastpage
    68
  • Abstract
    This paper presents the development and implementation of Motorola´s Graphical Manufacturing Monitoring System (GraMMS) that provides real-time graphical monitoring of manufacturing data including work-in-process (WIP), equipment, throughput, and dispatch rankings. GraMMS consists of four main applications namely; Dynamic Dispatch, WIP Monitoring System (WMS), Equipment Management System (EMS), and Throughput Monitoring System (TMS). GraMMS provides Motorola semiconductor wafer fabs with instant data-driven decision support and trend analysis as well as a short-interval scheduler via discrete-event simulation. The Dynamic Dispatch system is a combination of simulation and heuristics based on concepts from the theory of constraints. This competitive advantage increases output, decreases cycle time, and improves resource utilization
  • Keywords
    constraint theory; discrete event simulation; integrated circuit manufacture; process monitoring; production control; production engineering computing; real-time systems; GraMMS; Motorola; constraint theory; cycle time; data-driven decision support; discrete-event simulation; dispatch rankings; dynamic dispatch; equipment management system; graphical monitoring system; heuristics; manufacturing data; real-time graphical monitoring; resource utilization; short-interval scheduler; throughput; trend analysis; work-in-process; Constraint theory; Discrete event simulation; Job shop scheduling; Medical services; Monitoring; Pulp manufacturing; Real time systems; Resource management; Semiconductor device manufacture; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1523-553X
  • Print_ISBN
    0-7803-5403-6
  • Type

    conf

  • DOI
    10.1109/ISSM.1999.808739
  • Filename
    808739