DocumentCode
3367103
Title
Packaging and characterisation of ultra low power VCSEL for sensor networks
Author
Sohr, S. ; Fischer, D. ; Rieske, R. ; Nieweglowski, K. ; Wolter, K. -J
Author_Institution
Dept. of Electr. Eng. & Inf. Technol., Tech. Univ. Dresden, Dresden, Germany
fYear
2011
fDate
8-10 July 2011
Firstpage
121
Lastpage
127
Abstract
In this paper an ultra-low power VCSEL with an electrical consumption of below 5 mW is characterised to electrical power, optical power, temperature as well as a spectral investigation. First the pigtail manufacture is described, where amongst others the VCSEL is bonded on a ceramic carrier and connected to an optical fibre by front surface coupling. Thereby the fibre-chip coupling is realised by using index matching adhesive as well as active alignment. Finally the results of the characterisation are analysed to find optimal operation conditions. For comparison results of a common VCSEL are shown.
Keywords
adhesive bonding; distributed sensors; fibre optic sensors; integrated optoelectronics; measurement by laser beam; optical fibre fabrication; packaging; surface emitting lasers; ceramic carrier; electrical power; fibre-chip coupling; front surface coupling; index matching adhesive; optical fibre; optical power; pigtail manufacturing; sensor network; spectral investigation; temperature characterization; ultra low power VCSEL packaging; Optical fibers; Optical variables measurement; Semiconductor diodes; Stimulated emission; Temperature measurement; Vertical cavity surface emitting lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
Students and Young Scientists Workshop, 2011 International
Conference_Location
Cottbus
Print_ISBN
978-1-4577-1651-5
Type
conf
DOI
10.1109/STYSW.2011.6155858
Filename
6155858
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