• DocumentCode
    3367103
  • Title

    Packaging and characterisation of ultra low power VCSEL for sensor networks

  • Author

    Sohr, S. ; Fischer, D. ; Rieske, R. ; Nieweglowski, K. ; Wolter, K. -J

  • Author_Institution
    Dept. of Electr. Eng. & Inf. Technol., Tech. Univ. Dresden, Dresden, Germany
  • fYear
    2011
  • fDate
    8-10 July 2011
  • Firstpage
    121
  • Lastpage
    127
  • Abstract
    In this paper an ultra-low power VCSEL with an electrical consumption of below 5 mW is characterised to electrical power, optical power, temperature as well as a spectral investigation. First the pigtail manufacture is described, where amongst others the VCSEL is bonded on a ceramic carrier and connected to an optical fibre by front surface coupling. Thereby the fibre-chip coupling is realised by using index matching adhesive as well as active alignment. Finally the results of the characterisation are analysed to find optimal operation conditions. For comparison results of a common VCSEL are shown.
  • Keywords
    adhesive bonding; distributed sensors; fibre optic sensors; integrated optoelectronics; measurement by laser beam; optical fibre fabrication; packaging; surface emitting lasers; ceramic carrier; electrical power; fibre-chip coupling; front surface coupling; index matching adhesive; optical fibre; optical power; pigtail manufacturing; sensor network; spectral investigation; temperature characterization; ultra low power VCSEL packaging; Optical fibers; Optical variables measurement; Semiconductor diodes; Stimulated emission; Temperature measurement; Vertical cavity surface emitting lasers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Students and Young Scientists Workshop, 2011 International
  • Conference_Location
    Cottbus
  • Print_ISBN
    978-1-4577-1651-5
  • Type

    conf

  • DOI
    10.1109/STYSW.2011.6155858
  • Filename
    6155858