DocumentCode :
3367103
Title :
Packaging and characterisation of ultra low power VCSEL for sensor networks
Author :
Sohr, S. ; Fischer, D. ; Rieske, R. ; Nieweglowski, K. ; Wolter, K. -J
Author_Institution :
Dept. of Electr. Eng. & Inf. Technol., Tech. Univ. Dresden, Dresden, Germany
fYear :
2011
fDate :
8-10 July 2011
Firstpage :
121
Lastpage :
127
Abstract :
In this paper an ultra-low power VCSEL with an electrical consumption of below 5 mW is characterised to electrical power, optical power, temperature as well as a spectral investigation. First the pigtail manufacture is described, where amongst others the VCSEL is bonded on a ceramic carrier and connected to an optical fibre by front surface coupling. Thereby the fibre-chip coupling is realised by using index matching adhesive as well as active alignment. Finally the results of the characterisation are analysed to find optimal operation conditions. For comparison results of a common VCSEL are shown.
Keywords :
adhesive bonding; distributed sensors; fibre optic sensors; integrated optoelectronics; measurement by laser beam; optical fibre fabrication; packaging; surface emitting lasers; ceramic carrier; electrical power; fibre-chip coupling; front surface coupling; index matching adhesive; optical fibre; optical power; pigtail manufacturing; sensor network; spectral investigation; temperature characterization; ultra low power VCSEL packaging; Optical fibers; Optical variables measurement; Semiconductor diodes; Stimulated emission; Temperature measurement; Vertical cavity surface emitting lasers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Students and Young Scientists Workshop, 2011 International
Conference_Location :
Cottbus
Print_ISBN :
978-1-4577-1651-5
Type :
conf
DOI :
10.1109/STYSW.2011.6155858
Filename :
6155858
Link To Document :
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