Title :
Influence Of Design Geometry And Packaging On The Response Of Thermal Cmos Flow Sensors
Author :
Mayer, F. ; Paul, O. ; Baltes, H.
Author_Institution :
ETH Zurich
Keywords :
Bridge circuits; Electronic packaging thermal management; Fabrication; Fluid flow; Gas detectors; Geometry; Sensor phenomena and characterization; Silicon; Temperature sensors; Thermal sensors;
Conference_Titel :
Solid-State Sensors and Actuators, 1995 and Eurosensors IX.. Transducers '95. The 8th International Conference on
Print_ISBN :
91-630-3473-5
DOI :
10.1109/SENSOR.1995.717275
