Development of a novel air-back wafer carrier with an integrated endpoint detector for copper CMP application

Author

Sakai, Kenji ; Doy, Toshiroh Karaki ; Touzov, M.M. ; Satoh, Manaliu ; Kasai, Toshio

Author_Institution

Tokyo Seimitsu Co. Ltd., Japan

fYear

1999

fDate

1999

Firstpage

183

Lastpage

186

Abstract

This study presents the development of a novel air-back polishing carrier with an integrated Linear Variable Differential Transformer Endpoint Detector (LVDT EPD). In the course of this study, uniformity evaluation was performed on blanket PETEOS oxide and blanket copper wafers and dishing/erosion multi-step polish on patterned wafers. Employment of an air-back polishing carrier resulted in non-uniformity <3% 1σ. The LVDT EPD showed an excellent S/N ratio. The combination of LVDT EPD and air-back polishing carrier significantly enhanced the process performance in Cu CMP

Keywords

chemical mechanical polishing; copper; integrated circuit interconnections; integrated circuit manufacture; process monitoring; Cu; Cu CMP application; S/N ratio; air-back polishing carrier; air-back wafer carrier; blanket Cu wafers; blanket PETEOS oxide; dishing/erosion multi-step polish; integrated endpoint detector; integrated linear variable differential transformer endpoint detector; patterned wafers; process performance; uniformity evaluation; Auditory system; Computer hacking; Copper; Cost accounting; Gas detectors; Presses; Pressure control; Rails; Slurries; Tires;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on

Conference_Location

Santa Clara, CA

ISSN

1523-553X

Print_ISBN

0-7803-5403-6

Type

conf

DOI

10.1109/ISSM.1999.808767

Filename

808767