Title :
Novel dark-field patterned inspection system for 0.15-μm CMP processes
Author :
Saiki, Keiichi ; Noguchi, Minori ; Kondo, Yoshinori ; Watanabe, Kenji ; Nishiyama, Hidetoshi ; Hamamatsu, Akin ; Oshima, Yoshimasa
Author_Institution :
Dept. of Front-end Manuf. Technol., Hitachi Ltd., Ibaraki, Japan
Abstract :
A high-throughput high-sensitivity defect-inspection system has been developed for manufacturing 0.15-μm LSI devices and beyond. It incorporates a high-resolution imaging system with a multi-channel detector, high-resolution image optics with high-accuracy spatial filtering, and a new algorithm for setting the detection-level threshold. This system achieves a sensitivity of 0.15-μm on front-end processes and 0.3-μm on back-end processes. Because it can detect micro-scratches on Chemical Mechanical Polishing (CMP) surfaces, this system can be used to achieve a quick-feedback system for controlling the quality of CMP processes
Keywords :
chemical mechanical polishing; image resolution; inspection; integrated circuit yield; process control; process monitoring; quality control; spatial filters; 0.15 mum; CMP process quality control; CMP processes; LSI manufacturing yield; back-end processes; dark-field patterned inspection system; detection-level threshold; front-end processes; high-accuracy spatial filtering; high-resolution image optics; high-resolution imaging system; high-throughput high-sensitivity defect-inspection system; micro-scratch detection; multi-channel detector; polystyrene latex; quick-feedback system; sensitivity; Chemical processes; Control systems; Filtering algorithms; High-resolution imaging; Inspection; Large scale integration; Manufacturing; Optical detectors; Optical filters; Optical sensors;
Conference_Titel :
Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on
Conference_Location :
Santa Clara, CA
Print_ISBN :
0-7803-5403-6
DOI :
10.1109/ISSM.1999.808769
