Novel assessment of process control monitor in advanced semiconductor manufacturing: a complete set of addressable failure site test structures (AFS-TS)

This work describes the implementation of a novel assessment of process control monitor in advanced semiconductor manufacturing. It manifests the design and simulation results of addressable failure site test structures. Four novel test structures with three level interconnects have been developed and validated with an in-house simulation system. The novel test structures are used to identify the locations of killer defects. A test chip of 22×6.6 mm² containing four types test structures was implemented using a 0.25 μm logic backend of line process. This simple and efficient test structure for killer defect identification demonstrated its superiority in yield enhancement