Title :
A proposal for energy saving in semiconductor fabs
Author :
Suenaga, Osamu ; Kobayashi, Sadao ; Ohmi, Tadahiro
Author_Institution :
Tokyo Electron Ltd., Japan
Abstract :
This paper describes measurement of the energy consumption of diffusion furnaces and proceeds to propose several methods for energy saving. Measurements showed that cooling water consumes 71% of the energy, exhaust air 11% and dry coil (heat transferred to clean room air) 18%. In terms of cost (in Yen), cooling water accounts for 32%, exhaust air 46% and dry coil 22%. Proposals are raised for reducing the energy consumption of the furnace to less than a half of conventional ones by: employment of double layer cooler; replacement of exhaust from clean room air by partially treated air; and employment of heat insulation material for the furnace casing
Keywords :
clean rooms; cooling; furnaces; integrated circuit manufacture; thermal insulation; clean room air; cooling water; cost; diffusion furnaces; double layer cooler; dry coil; energy consumption; energy saving; exhaust air; furnace casing; heat insulation material; partially treated air; semiconductor fabs; Coils; Cooling; Costs; Employment; Energy consumption; Energy measurement; Furnaces; Heat transfer; Proposals; Water heating;
Conference_Titel :
Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on
Conference_Location :
Santa Clara, CA
Print_ISBN :
0-7803-5403-6
DOI :
10.1109/ISSM.1999.808784