Environmentally conscious APM: efficient dilution based on theoretical approach

Author

Kobayashi, Takehiko ; Inoue, Yoshiyuki

Author_Institution

Semicond. Oper., IBM Japan Ltd., Shiga, Japan

fYear

1999

fDate

1999

Firstpage

263

Lastpage

266

Abstract

A more efficient APM dilution method was introduced into our manufacturing process, along with an advanced model. The new chemical mixing ratio of diluted APM was fixed at NH₄OH/H₂O ₂/H₂O=1/2/40 theoretically. The performance of diluted APM in cleaning technique and semiconductor characteristics is equivalent or superior to that of conventional APM. Application of this new diluted APM to our semiconductor wet cleaning process has drastically reduced chemical consumption and the waste volume of ammonia and hydrogen peroxide. This activity indicates one direction for realizing a low cost and environmentally conscious wet cleaning process

Keywords

environmental factors; semiconductor process modelling; surface cleaning; NH₄OH-H₂O₂-H₂O; chemical consumption; chemical mixing ratio; cleaning technique; dilution method; environmentally conscious APM; manufacturing process; semiconductor characteristics; waste volume; wet cleaning process; Chemical processes; Chemical technology; Cleaning; Costs; Etching; Laboratories; Manufacturing processes; Protection; Silicon; Thermal degradation;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on

Conference_Location

Santa Clara, CA

ISSN

1523-553X

Print_ISBN

0-7803-5403-6

Type

conf

DOI

10.1109/ISSM.1999.808786

Filename

808786