DocumentCode :
3367650
Title :
Environmentally conscious APM: efficient dilution based on theoretical approach
Author :
Kobayashi, Takehiko ; Inoue, Yoshiyuki
Author_Institution :
Semicond. Oper., IBM Japan Ltd., Shiga, Japan
fYear :
1999
fDate :
1999
Firstpage :
263
Lastpage :
266
Abstract :
A more efficient APM dilution method was introduced into our manufacturing process, along with an advanced model. The new chemical mixing ratio of diluted APM was fixed at NH4OH/H2O 2/H2O=1/2/40 theoretically. The performance of diluted APM in cleaning technique and semiconductor characteristics is equivalent or superior to that of conventional APM. Application of this new diluted APM to our semiconductor wet cleaning process has drastically reduced chemical consumption and the waste volume of ammonia and hydrogen peroxide. This activity indicates one direction for realizing a low cost and environmentally conscious wet cleaning process
Keywords :
environmental factors; semiconductor process modelling; surface cleaning; NH4OH-H2O2-H2O; chemical consumption; chemical mixing ratio; cleaning technique; dilution method; environmentally conscious APM; manufacturing process; semiconductor characteristics; waste volume; wet cleaning process; Chemical processes; Chemical technology; Cleaning; Costs; Etching; Laboratories; Manufacturing processes; Protection; Silicon; Thermal degradation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on
Conference_Location :
Santa Clara, CA
ISSN :
1523-553X
Print_ISBN :
0-7803-5403-6
Type :
conf
DOI :
10.1109/ISSM.1999.808786
Filename :
808786
Link To Document :
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