DocumentCode :
3367657
Title :
Optimal spare utilization for reliability and mean lifetime improvement of logic built-in self-repair
Author :
Koal, Tobias ; Vierhaus, Heinrich Theodor
Author_Institution :
Comput. Sci., Tech. Univ. of Brandenburg, Cottbus, Germany
fYear :
2011
fDate :
13-15 April 2011
Firstpage :
219
Lastpage :
224
Abstract :
Reliability and the mean lifetime are major aspects in today´s semiconductor device manufacturing. The continuous downscaling of transistor sizes and power supplies are the root causes of higher vulnerabilities of integrated circuits against time zero process variation, time dependent degradation and random faults induced by environmental influences like particle strikes. Handling permanent faults becomes inevitably a suitable solution to guarantee high reliabilities as well as increased lifetimes. Built-in self-repair is a possible solution, which exchanges faulty units with spare parts at the costs of extra hardware. In this paper, we evaluate the influence of different replacement strategies and their resulting additional hardware structures on reliability and mean lifetime. This analytical process allows to find the optimal replacement strategy for a given system, without implementing and synthesizing each case.
Keywords :
built-in self test; integrated circuit reliability; semiconductor device manufacture; integrated circuit vulnerability; logic built-in self-repair; mean lifetime improvement; optimal replacement strategy; optimal spare utilization; power supplies; random faults; reliability improvement; semiconductor device manufacturing; time dependent degradation; time zero process variation; transistor size downscaling; Circuit faults; Computer architecture; Hardware; Integrated circuit reliability; Multiplexing; Redundancy; BISR; MTTF; Reliability; SBST;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design and Diagnostics of Electronic Circuits & Systems (DDECS), 2011 IEEE 14th International Symposium on
Conference_Location :
Cottbus
Print_ISBN :
978-1-4244-9755-3
Type :
conf
DOI :
10.1109/DDECS.2011.5783083
Filename :
5783083
Link To Document :
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