• DocumentCode
    3367657
  • Title

    Optimal spare utilization for reliability and mean lifetime improvement of logic built-in self-repair

  • Author

    Koal, Tobias ; Vierhaus, Heinrich Theodor

  • Author_Institution
    Comput. Sci., Tech. Univ. of Brandenburg, Cottbus, Germany
  • fYear
    2011
  • fDate
    13-15 April 2011
  • Firstpage
    219
  • Lastpage
    224
  • Abstract
    Reliability and the mean lifetime are major aspects in today´s semiconductor device manufacturing. The continuous downscaling of transistor sizes and power supplies are the root causes of higher vulnerabilities of integrated circuits against time zero process variation, time dependent degradation and random faults induced by environmental influences like particle strikes. Handling permanent faults becomes inevitably a suitable solution to guarantee high reliabilities as well as increased lifetimes. Built-in self-repair is a possible solution, which exchanges faulty units with spare parts at the costs of extra hardware. In this paper, we evaluate the influence of different replacement strategies and their resulting additional hardware structures on reliability and mean lifetime. This analytical process allows to find the optimal replacement strategy for a given system, without implementing and synthesizing each case.
  • Keywords
    built-in self test; integrated circuit reliability; semiconductor device manufacture; integrated circuit vulnerability; logic built-in self-repair; mean lifetime improvement; optimal replacement strategy; optimal spare utilization; power supplies; random faults; reliability improvement; semiconductor device manufacturing; time dependent degradation; time zero process variation; transistor size downscaling; Circuit faults; Computer architecture; Hardware; Integrated circuit reliability; Multiplexing; Redundancy; BISR; MTTF; Reliability; SBST;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design and Diagnostics of Electronic Circuits & Systems (DDECS), 2011 IEEE 14th International Symposium on
  • Conference_Location
    Cottbus
  • Print_ISBN
    978-1-4244-9755-3
  • Type

    conf

  • DOI
    10.1109/DDECS.2011.5783083
  • Filename
    5783083