• DocumentCode
    3367809
  • Title

    Improving throughput in 0.25 /spl mu/m technology development and manufacturing - CVD TiN liner barrier applications

  • Author

    Brennan, B. ; Rivera, W. ; Christian, C. ; Kin Sang Lam ; Pursley, C.

  • Author_Institution
    Adv. Micro Devices Inc., Austin, TX, USA
  • fYear
    1999
  • fDate
    11-13 Oct. 1999
  • Firstpage
    313
  • Lastpage
    316
  • Abstract
    During 0.25 /spl mu/m process development and transfer, functional yields were not obtained until the CVD TiN liner barrier process applications were used at five of the six barrier-levels. The process transfer and capital equipment plan did not comprehend this required technology improvement, resulting in these CVD TiN tools becoming a constraint. Aggressive capital equipment installations and manufacturing technology initiatives were implemented to provide the needed capacity to support the ramp plan. Integrated CVD TiN focus teams were sanctioned and chartered to improve the operation productivity. These efforts and results eliminated this tool set from becoming a technology or capacity constraint.
  • Keywords
    CVD coatings; integrated circuit manufacture; integrated circuit metallisation; titanium compounds; 0.25 micron; CVD TiN liner barrier applications; CVD TiN tools; TiN; capital equipment installations; constraint elimination; integrated CVD TiN focus teams; manufacturing technology initiatives; manufacturing throughput improvement; one-quarter micron process manufacturing; one-quarter micron process technology development; operation productivity improvement; Acceleration; Atherosclerosis; Hardware; Inorganic materials; Manufacturing processes; Production; Productivity; Throughput; Tin; Tungsten;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on
  • Conference_Location
    Santa Clara, CA, USA
  • ISSN
    1523-553X
  • Print_ISBN
    0-7803-5403-6
  • Type

    conf

  • DOI
    10.1109/ISSM.1999.808798
  • Filename
    808798