DocumentCode :
3367839
Title :
Table of contents
fYear :
2009
fDate :
1-3 April 2009
Abstract :
The following topics on microelectromecahnical (MEMS) devices are dealt with: mechanical simulation; assembly technologies; bioMEMS; multiphysics simulation; devices and components; micro power generation; failure analysis; NEMS; and thermal evaluation.
Keywords :
bioMEMS; electronics packaging; micromechanical devices; nanoelectromechanical devices; power supplies to apparatus; NEMS; assembly technology; bioMEMS; failure analysis; mechanical simulation; micro power generation; microelectromecahnical devices; multiphysics simulation; thermal evaluation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Test, Integration & Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09. Symposium on
Conference_Location :
Rome
Print_ISBN :
978-1-4244-3874-7
Type :
conf
Filename :
4919472
Link To Document :
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