Title :
Combined x-ray tool for process control of compound dielectric films
Author :
Terada, Shinichi
Author_Institution :
Technos Co. Ltd., Osaka, Japan
Abstract :
Thickness is an important parameter that must be controlled in the production of films for microelectronic devices. If a film is composed of two or more components, composition control is also essential, because small changes in composition results in significant changes in the electric properties of dielectric materials. XRF has been used for the simultaneous determination of thickness and composition. However, there are several problems with this method. Therefore, we developed a new tool that combines the X-ray interference method (XI) and grazing incidence X-ray fluorescence method (GIXRF)
Keywords :
X-ray diffraction; X-ray fluorescence analysis; chemical variables control; dielectric thin films; process control; thickness control; X-ray interference; combined X-ray tool; composition control; compound dielectric film; electric properties; grazing incidence X-ray fluorescence; microelectronic device; process control; thickness control; Composite materials; Dielectric films; Dielectric materials; Ferroelectric materials; Fluorescence; Interference; Optical films; Process control; Production; Thickness measurement;
Conference_Titel :
Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on
Conference_Location :
Santa Clara, CA
Print_ISBN :
0-7803-5403-6
DOI :
10.1109/ISSM.1999.808812
