DocumentCode :
3368120
Title :
Yield improvement using data mining system
Author :
Mieno, Fumitake ; Sato, Tosiya ; Shibuya, Yuki ; Odagiri, Koukichi ; Tsuda, Hidetaka ; Take, Riichiro
Author_Institution :
Dept. of Manuf. Technol., Fujitsu Ltd., Iwate, Japan
fYear :
1999
fDate :
1999
Firstpage :
391
Lastpage :
394
Abstract :
It is ideal to prevent all failures. However, when a failure occurs, it is important to quickly specify the cause stage and take countermeasures. There are various types of failures, ranging from the failures due to simple mis-operation to the failures whose cause analysis takes many highly skilled engineers a long time. If the failure cause in the latter case can be specified simply by anyone, the yield enhancement will be accelerated. We are developing a method that enables us to specify a failure cause, without depending on the experience and skills of engineers. Data mining is a method for extracting buried information and rules from data of enormous quantity, by using a statistical method. Some examples have been reported in various fields but only a few in the semiconductor field. This time, we have applied a regression tree analysis system, which is one of data mining tool´s codeveloped by Fujitsu Laboratories Ltd. and FLT, to failure analysis in LSI manufacturing. As a result, a failure cause which has been difficult to be detected even in the in-process monitoring was specified automatically only in six hours. Then, through the verification process, we ascertained that the failure cause was correct. We could specify the cause and take countermeasures at a speed six times faster than by the conventional method
Keywords :
data mining; failure analysis; integrated circuit yield; large scale integration; statistical analysis; LSI manufacturing; buried information; cause analysis; data mining system; failure analysis; failures; regression tree analysis system; verification process; yield enhancement; yield improvement; Acceleration; Computerized monitoring; Condition monitoring; Data mining; Failure analysis; Laboratories; Large scale integration; Regression tree analysis; Semiconductor device manufacture; Statistical analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on
Conference_Location :
Santa Clara, CA
ISSN :
1523-553X
Print_ISBN :
0-7803-5403-6
Type :
conf
DOI :
10.1109/ISSM.1999.808818
Filename :
808818
Link To Document :
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